AD3000T-PLUS | Dicing Machine | ACCRETECH - TOKYO SEIMITSU
WEBFully automatic dicing machine for Φ300mm wafers. AD3000T-PLUS. The opposing type 2-axis spindles are arranged diagonally, to achieve both a reduced space design and high maintainability. All daily operations such as blade replacement and maintenance work can be performed using front access from the front of the device.
AD3000TW | Dicing Machines | ACCRETECH - TOKYO SEIMITSU
WEBA fully automatic blade dicing machine equipped with an opposing type 2-axis spindle that supports large packages. AD3000TW. The device follows the AD3000T-PLUS design concept. The dedicated design is specialized for large package substrate dicing, starting with the fan-out WLP.
AD3000T-HC PLUS | Dicing Machines | ACCRETECH - TOKYO …
WEBFully automatic dicing machine for Φ300mm wafers. AD3000T-HC PLUS. The device follows the AD3000T-PLUS design concept. As a new added value, it supports both wafer handling specifications using FOUP cassettes and frame handling specifications using regular cassettes.
AD3000T Plus wafer dicer - maximum perfomance and small space
WEBSmallest 12 Inch Dicing Machine in the World. High processing speed: X-axis up to 1,000 mm/ Y-axis up to 300 mm/s. The smallest blade-to-blade distance worldwide. Graphical User Interface with Help Function. Easy & Simple Kerf Check Function.
WEBVast resource accumulated on Dicing Technology over four decades has enabled us to introduce next generation of Dicing machine, Model AD3000T-PLUS with latest technology in FLUIDIC ENGINEERING and ENERGY CONSERVATION to lead the world with Dicing technology. World’s smallest Dicing Machine Achieved smallest footprint possible
WEBVast resource accumulated on Dicing Technology over four decades has enabled us to introduce next generation of Dicing machine, Model AD3000T with latest technology in FLUIDIC ENGINEERING, MECHATRONICS ENGINEERING and ENERGY CONSERVATION to lead the world with Dicing technology. World’s smallest Dicing Machine Achieved smallest footprint possible
Full Automatic Blade Dicing Machine AD3000T-HC PLUS
WEBFull Automatic Blade Dicing Machine AD3000T-HC PLUS. Fully automatic dicing machine capable of automatic switchover between frame handling and bare wafer handling without the need of any hardware conversion to enable high productivity of half cut dicing process.
ACCRETECH AD3000T Slicing, Dicing & Wafering Grinders
WEBProduct Overview. Optimized spacing by utilizing all components and optional unit well within the compartment Standard Spindles up to 60,000 rpm (80,000 rpm as optional) Enhanced throughput ①X axis 1,000 mm/sec, Y axis 300 mm/sec, and Z axis 80 mm/sec ②Two Optical Cutter-Set units ③The Worlds’ smallest blade-to-blade distance 17” LCD ...
Full Automatic Blade Dicing Machine AD3000T-PLUS - Accretech
WEBSmallest footprint 300mm Frame Handling Dicing Machine in the World. Capable to process up to 300mm wafer size on 300mm dicing frame. High processing speed: X-axis up to 1,000 mm/ sec & Y-axis up to 300 mm/sec. Standard Spindle up to 60,000 rpm compatible with blade up to 60mm in diameter.
WEBWorld's most efficient Dicing Machine. Delivering fast X-axis (Up to 1,000mm/sec) and Y-axis (Up to 300mm/sec) processing speed. Low Cost of ownership. Introducing refined Graphic User Interface. feature for ease of operation.